High Quality Monolith Grinding Pen To Erase / Clean / Remove Compound Layer From The Bottom Side of Monolith Device
GrindingΒ β is a special process of compound erasing from the bottom side of monolith device. During this process, engineer have to be very careful, because he can damage the cupper layer and make further monolith recovery absolutely impossible.
Most of the DR professionals use cheap jeweller sandpaper with the smallest size. Unfortunately, sandpaper can erase the cupper contacts because itβs surface can easily erase all parts of our monolith device β plastic and metal. So, what we can use this special Pen! which allow us to erase the compound layer of monolith very careful without making injures to cupper scheme.
PC: @acelab
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